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We offer ingot slicing beams for use in fixturing various semiconductor materials in preparation for the wafering process. These substrates can be fully customized to accomodate various ingot diameter and lengths as well as custom designed to meet specific user requirements.

 

The ingot slicing beams are available in a variety of material formulations allowing use in multiple wafering processes including slurry wire slicing, diamond wire slicing and ID saw slicing. The unique surface conditions of these slicing beams have a high affinity for epoxy adhesives and prevent epoxy residue from remaining on sliced wafers in post slice demounting and cleaning applications.
 

 

Feel free to contact us for more technical information on these products by using our contact form, email or phone number.

We can always be reached

+41 32 466 61 66

 

 

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