Epoxy Adhesive Systems

Epoxy adhesive systems are available in several formulations and can be custom made to meet specific performance requirements for wire saw wafering.

These patented two-component adhesive systems offer the performance necessary to maximize production throughput and reduce the amount of stress occurring between the PV crystalline material and the adhesive.

This reduction in stress results in a decrease in the amount of edge chips and wafer drops that can occur during slicing. Easy removal of the epoxy from the wafers is accomplished using  demounting solutions which eliminate the need for aggressive acids, caustics, and solvents.  epoxy adhesives are fast curing at room temperature and are color pigmented to easily indicate when the mix of resin and hardener is complete.